Polyimide Resin

• CAT Number: M018526
• CAS Number: 62929-02-6
• Molecular Formula: C35H28N2O7
• Molecular Weight: 588.61
• Purity: ≥95%
• Storage: Room Temperature
• IUPAC Name: 1-(4-aminophenyl)-1,3,3-trimethyl-2H-inden-5-amine;5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione
• InChI: InChI=1S/C18H22N2.C17H6O7/c1-17(2)11-18(3,12-4-6-13(19)7-5-12)15-9-8-14(20)10-16(15)17;18-13(7-1-3-9-11(5-7)16(21)23-14(9)19)8-2-4-10-12(6-8)17(22)24-15(10)20/h4-10H,11,19-20H2,1-3H3;1-6H
• InChIKey: CDTDIQLZIBORMV-UHFFFAOYSA-N
• SMILES: CC1(CC(C2=C1C=C(C=C2)N)(C)C3=CC=C(C=C3)N)C.C1=CC2=C(C=C1C(=O)C3=CC4=C(C=C3)C(=O)OC4=O)C(=O)OC2=O

Polyimide resin（Cat No.:M018526）, is a high-performance polymer known for its exceptional thermal stability, mechanical properties, and resistance to chemicals and radiation. It is widely used in aerospace, electronics, and other industries for applications requiring durability and heat resistance. Polyimide resins are often used in the manufacture of flexible printed circuit boards (PCBs), insulation materials, and protective coatings due to their ability to withstand extreme conditions.

Reference

1: Trikantzopoulos E, Yang C, Ganesana M, Wang Y, Venton BJ. Novel carbon-fiber
microelectrode batch fabrication using a 3D-printed mold and polyimide resin.
Analyst. 2016 Sep 21;141(18):5256-5260. doi: 10.1039/c6an01469k. Epub 2016 Aug
18. PubMed PMID: 27536741; PubMed Central PMCID: PMC5019535.