Polyimide resin（Cat No.:M018526）, is a high-performance polymer known for its exceptional thermal stability, mechanical properties, and resistance to chemicals and radiation. It is widely used in aerospace, electronics, and other industries for applications requiring durability and heat resistance. Polyimide resins are often used in the manufacture of flexible printed circuit boards (PCBs), insulation materials, and protective coatings due to their ability to withstand extreme conditions.
| Catalog Number | M018526 |
| CAS Number | 62929-02-6 |
| Synonyms | -2,3-dihydro-1,3,3(or1,1,3)-trimethyl-1h-inden-5-amine;3-isobenzofurandione,5,5’-carbonylbis-polymerwith1(or3)-(4-aminophenyl);POLYIMIDE RESIN;Polyimideresins;Polyimides;1,3-Isobenzofurandione, 5,5-carbonylbis-, polymer with 1(or 3)-(4-aminophenyl)-2 |
| Molecular Formula | C35H28N2O7 |
| Purity | 95% |
| Storage | Room Temperature |
| IUPAC Name | 1-(4-aminophenyl)-1,3,3-trimethyl-2H-inden-5-amine;5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione |
| InChI | InChI=1S/C18H22N2.C17H6O7/c1-17(2)11-18(3,12-4-6-13(19)7-5-12)15-9-8-14(20)10-16(15)17;18-13(7-1-3-9-11(5-7)16(21)23-14(9)19)8-2-4-10-12(6-8)17(22)24-15(10)20/h4-10H,11,19-20H2,1-3H3;1-6H |
| InChIKey | CDTDIQLZIBORMV-UHFFFAOYSA-N |
| SMILES | CC1(CC(C2=C1C=C(C=C2)N)(C)C3=CC=C(C=C3)N)C.C1=CC2=C(C=C1C(=O)C3=CC4=C(C=C3)C(=O)OC4=O)C(=O)OC2=O |
| Reference | 1: Trikantzopoulos E, Yang C, Ganesana M, Wang Y, Venton BJ. Novel carbon-fiber |
