Polyimide Resin - CAS 62929-02-6

Polyimide resin(Cat No.:M018526), is a high-performance polymer known for its exceptional thermal stability, mechanical properties, and resistance to chemicals and radiation. It is widely used in aerospace, electronics, and other industries for applications requiring durability and heat resistance. Polyimide resins are often used in the manufacture of flexible printed circuit boards (PCBs), insulation materials, and protective coatings due to their ability to withstand extreme conditions.

Catalog Number: M018526

CAS Number: 62929-02-6

PubChem Substance ID:355196118

Molecular Formula: C35H28N2O7

Molecular Weight:588.61

Purity: ≥95%

* For research use only. Not for human or veterinary use.

Synonym

Synonyms-2,3-dihydro-1,3,3(or1,1,3)-trimethyl-1h-inden-5-amine;3-isobenzofurandione,5,5’-carbonylbis-polymerwith1(or3)-(4-aminophenyl);POLYIMIDE RESIN;Polyimideresins;Polyimides;1,3-Isobenzofurandione, 5,5-carbonylbis-, polymer with 1(or 3)-(4-aminophenyl)-2

Property

Molecular Formula: C35H28N2O7
Molecular Weight588.61
Purity≥95%
StorageRoom Temperature

Computed Descriptor

IUPAC Name1-(4-aminophenyl)-1,3,3-trimethyl-2H-inden-5-amine;5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione
InChIInChI=1S/C18H22N2.C17H6O7/c1-17(2)11-18(3,12-4-6-13(19)7-5-12)15-9-8-14(20)10-16(15)17;18-13(7-1-3-9-11(5-7)16(21)23-14(9)19)8-2-4-10-12(6-8)17(22)24-15(10)20/h4-10H,11,19-20H2,1-3H3;1-6H
InChIKeyCDTDIQLZIBORMV-UHFFFAOYSA-N
SMILESCC1(CC(C2=C1C=C(C=C2)N)(C)C3=CC=C(C=C3)N)C.C1=CC2=C(C=C1C(=O)C3=CC4=C(C=C3)C(=O)OC4=O)C(=O)OC2=O