For research use only. Not for therapeutic Use.
4,4′-Bis(2,3-epoxypropoxy)-3,3′,5,5′-tetramethylbiphenyl(Cat No.:M011705)is a multifunctional epoxy compound with the molecular formula C22H26O4. It features a biphenyl core substituted with epoxypropoxy groups and methyl groups at the 3,3′,5,5′ positions, providing both rigidity and reactivity. This compound is used as a crosslinking agent or curing component in high-performance epoxy resins for coatings, adhesives, composites, and electronic encapsulants. Its symmetrical structure and multiple reactive sites contribute to enhanced thermal stability, chemical resistance, and mechanical strength in polymer systems. It is valued in industrial applications requiring durable, high-performance thermosetting materials. Proper safety measures are advised during handling.
| CAS Number | 85954-11-6 |
| Synonyms | 4,4′-bis(glycidyloxy)-3,3′,5,5′-tetramethylbiphenyl;4,4′-Bis(2,3-epoxypropoxy)-3,3′,5,5′-tetramethylbiphenyl;3,3′,5,5′-Tetramethyl-4,4′-diphenol diglycidyl ether;2,2′-{[3,3’5,5′-tetramethyl(1,1′-biphenyl)-4,4′-diyl]bis(oxymethylene)}bis |
| Molecular Formula | C22H26O4 |
| Purity | ≥95% |
| Storage | -20°C |
| IUPAC Name | 2-[[4-[3,5-dimethyl-4-(oxiran-2-ylmethoxy)phenyl]-2,6-dimethylphenoxy]methyl]oxirane |
| InChI | InChI=1S/C22H26O4/c1-13-5-17(6-14(2)21(13)25-11-19-9-23-19)18-7-15(3)22(16(4)8-18)26-12-20-10-24-20/h5-8,19-20H,9-12H2,1-4H3 |
| InChIKey | HRSLYNJTMYIRHM-UHFFFAOYSA-N |
| SMILES | CC1=CC(=CC(=C1OCC2CO2)C)C3=CC(=C(C(=C3)C)OCC4CO4)C |
| Chemistry Calculators | Dilution Calculator In vivo Formulation Calculator Molarity Calculator Molecular Weight Calculator Reconstitution Calculator |